{"content":"**FEG Components Sdn Bhd**\n\nWe specialize in OEM spare parts for dicing saw, wire bonder, die bonder, laser mark, tester, handler and general electronic components.\n\nOUR PRODUCTS\n------------\n\n![](https://cdn1.npcdn.net/userfiles/21451/image/PIC5(1).png)\n\nABOUT US\n--------\n\nFEG Components Sdn Bhd was incorporated in year 1993 and started its operation majoring in trading OEM spare parts for dicing saw, wire bonder, die bonder, laser mark, tester, handler and general electronic components. The company was set up at Melaka, Malaysia. Our customers are mainly in semiconductor industries with majority of clients are from multinational companies.  \n[MORE](index.php?ws=pages&pages_id=14094)\n\nWHAT MAKES US DIFFERENT\n-----------------------\n\n![](https://cdn1.npcdn.net/userfiles/21451/image/pic1(1).jpg)\n\n### Commitment\n\n![](https://cdn1.npcdn.net/userfiles/21451/image/pic2.jpg)\n\n### Professional Services\n\n![](https://cdn1.npcdn.net/userfiles/21451/image/pic3.jpg)\n\n### Cost Effective\n\n![](https://cdn1.npcdn.net/userfiles/21451/image/pic4.jpg)\n\n### Achievements\n\nContact Us\n----------\n\n06-234 4255\n\nFEG Engineering Sdn Bhd\n-----------------------\n\n04-630 7103\n\nFEG Components (Ipoh) Sdn Bhd\n-----------------------------\n\n05-243 3054","original_url":"https://m.feg.com.my/","word_count":129,"key_claims":["OEM spare parts for semiconductor equipment","Dicing saw, wire bonder, die bonder components","Electronic components manufacturer"],"content_summary":"FEG Components manufactures OEM spare parts for semiconductor manufacturing equipment.","expertise_signals":["Semiconductor OEM parts","Electronic components"]}